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this is preliminary information on a new product now in development or undergoing evaluation. details are subject to change without notice. june 2014 docid025909 rev 2 1/19 std11n50m2, STF11N50M2 n-channel 500 v, 0.45 ? typ,8 a, mdmesh ii plus? low qg power mosfets in dpak and to-220fp packages datasheet - preliminary data figure 1. internal schematic diagram features ? extremely low gate charge ? lower r ds(on) x area vs previous generation ? low gate input resistance ? 100% avalanche tested ? zener-protected applications ? switching applications description these devices are n-channel power mosfets developed using a new generation of mdmesh? technology: mdmesh ii plus? low q g . these revolutionary power mosfets associate a vertical structure to the company's strip layout to yield one of the world's lowest on-resistance and gate charge. they are therefore suitable for the most demanding high efficiency converters. am15572v1 , tab to-220fp dpak 1 3 tab 1 2 3 order codes v ds @ t jmax r ds(on) max i d std11n50m2 550 v 0.53 ? 8 a STF11N50M2 table 1. device summary order codes marking package packaging std11n50m2 11n50m2 dpak tape and reel STF11N50M2 to-220fp tube www.st.com
contents std11n50m2, STF11N50M2 2/19 docid025909 rev 2 contents 1 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 4.1 dpak, std11n50m2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 4.2 to-220fp, STF11N50M2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 5 packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 docid025909 rev 2 3/19 std11n50m2, STF11N50M2 electrical ratings 19 1 electrical ratings table 2. absolute maximum ratings symbol parameter value unit dpak to-220fp v gs gate-source voltage 25 v i d drain current (continuous) at t c = 25 c 8 a i d drain current (continuous) at t c = 100 c 5 a i dm (1) drain current (pulsed) 32 a p tot total dissipation at t c = 25 c 85 25 w dv/dt (1) 1. i sd 8 a, di/dt 400 a/ s; v ds peak < v (br)dss , v dd =400 v peak diode recovery voltage slope 15 v/ns dv/dt (2) 2. v ds 400 v mosfet dv/dt ruggedness 50 v iso insulation withstand voltage (rms) from all three leads to external heat sink (t=1 s; t c = 25 c) 2500 t stg storage temperature - 55 to 150 c t j max. operating junction temperature table 3. thermal data symbol parameter value unit dpak to-220fp r thj-case thermal resistance junction-case max 1.47 5 c/w r thj-pcb thermal resistance junction-pcb max (1) 1. when mounted on 1 inch2 fr-4, 2 oz copper board 50 c/w r thj-amb thermal al resistance junction-ambient max 62.5 c/w table 4. avalanche characteristics symbol parameter value unit dpak to-220fp i ar avalanche current, repetitive or not repetitive (pulse width limited by t jmax ) 2a e as single pulse avalanche energy (starting t j =25c, i d = i ar ; v dd =50) 190 mj electrical characteristics std11n50m2, STF11N50M2 4/19 docid025909 rev 2 2 electrical characteristics (t c = 25 c unless otherwise specified) table 5. on /off states symbol parameter test conditions min. typ. max. unit v (br)dss drain-source breakdown voltage v gs = 0, i d = 1 ma 500 v i dss zero gate voltage drain current v gs = 0, v ds = 500 v 1 a v gs = 0, v ds = 500 v, t c =125 c 100 a i gss gate-body leakage current v ds = 0, v gs = 25 v 10 a v gs(th) gate threshold voltage v ds = v gs , i d = 250 a234v r ds(on) static drain-source on-resistance v gs = 10 v, i d = 4 a 0.45 0.53 ? table 6. dynamic symbol parameter test conditions min. typ. max. unit c iss input capacitance v gs = 0, v ds = 100 v, f = 1 mhz -395-pf c oss output capacitance - 26 - pf c rss reverse transfer capacitance -1-pf c oss eq. (1) 1. c oss eq. is defined as a constant equivalent capacitance giving the same charging time as c oss when v ds increases from 0 to 80% v dss equivalent output capacitance v gs = 0, v ds = 0 to 400 v - 108 - pf r g intrinsic gate resistance f = 1 mhz, i d =0 - 6.3 - q g total gate charge v dd = 400 v, i d = 8a, v gs = 10 v (see figure 17 ) -12-nc q gs gate-source charge - 2 - nc q gd gate-drain charge - 6.4 - nc table 7. switching times symbol parameter test conditions min. typ. max. unit t d(on) turn-on delay time v dd = 250 v, i d = 4a, r g = 4.7 ? , v gs = 10 v (see figure 16 and figure 21 ) -11-ns t r rise time - 9 - ns t d(off) turn-off delay time - 8 - ns t f fall time - 28.5 - ns docid025909 rev 2 5/19 std11n50m2, STF11N50M2 electrical characteristics 19 table 8. source drain diode symbol parameter test conditions min. typ. max. unit i sd source-drain current - 8 a i sdm (1) 1. pulse width limited by safe operating area. source-drain current (pulsed) - 32 a v sd (2) 2. pulsed: pulse duration = 300 s, duty cycle 1.5% forward on voltage v gs = 0, i sd = 8 a - 1.6 v t rr reverse recovery time i sd = 8 a, di/dt = 100 a/ s v dd = 60 v (see figure 18 ) - 258 ns q rr reverse recovery charge - 1.84 c i rrm reverse recovery current - 14.3 a t rr reverse recovery time i sd = 8 a, di/dt = 100 a/ s v dd = 60 v, t j = 150 c (see figure 18 ) - 370 ns q rr reverse recovery charge - 2.87 c i rrm reverse recovery current - 15.5 a electrical characteristics std11n50m2, STF11N50M2 6/19 docid025909 rev 2 2.1 electrical characteristics (curves) figure 2. safe operating area for dpak figure 3. thermal impedance for dpak , ' 9 ' 6 9 $ 2 s h u d w l r q l q w k l v d u h d l v / l p l w h g e \ p d [ 5 ' 6 r q ? v p v ? v 7 m ? & 7 f ? & 6 l q j o h s x o v h p v * , 3 * 6 $ figure 4. safe operating area for to-220fp figure 5. thermal impedance for to-220fp figure 6. output characteristics figure 7. transfer characteristics , ' 9 ' 6 9 $ 2 s h u d w l r q l q w k l v d u h d l v / l p l w h g e \ p d [ 5 ' 6 r q ? v p v ? v 7 m ? & 7 f ? & 6 l q j o h s x o v h p v * , 3 * 6 $ , ' 9 ' 6 9 $ 9 9 9 * 6 9 9 9 * , 3 * 6 $ , ' 9 * 6 9 $ 9 ' 6 9 * , 3 * 6 $ docid025909 rev 2 7/19 std11n50m2, STF11N50M2 electrical characteristics 19 figure 8. gate charge vs gate-source voltage figure 9. static drain-source on-resistance figure 10. capacitance variations figure 11. output capacitance stored energy figure 12. normalized gate threshold voltage vs temperature figure 13. normalized on-resistance vs temperature 9 * 6 4 j q & |